At a glance:
- Light microscopy
- Scanning Electron Microscopy (SEM)
- Energy-dispersive X-ray spectroscopy (EDX)
- X-ray inspection
- Fourier-Transform-Infrared spectroscopy (FTIR)
- Fully-automated solderability-tests
- Electron-Backscatter-Diffraction analysis (EBSD)
- Ion etching
- X-ray Photoelektron Spectroscopy (XPS)
Analytics for electronic components
Analysis of electronic components becomes more and more major important for component manufacturing and component processing. Corresponding tests are essential for instance in case of quality problems (detection of failure mechanisms) and production defects or are applied for the determination of the component condition in order to localize failure causes respectively to evaluate failure potentials.
On the basis of examination results of the HTV-analytics laboratory and its detailed documentation a causal clarification for the case of application is immediately possible.
Detailed examination results
Specific analysis procedures are necessary in order to assure the quality of the final product, particularly with regard to products of uncertain origin. Besides the evaluation of the visual condition of goods detailed examinations via light microscopy, X-ray technology, electron microscopy or sample preparations and microsections, are performed providing information about the present condition of the components. Thus, astatement regarding the duration of a reliable processability of the components is enabled.
For the evaluation of an intermetallic phase growth a SEM-analysis (scanning electron microscopy) is performed recording specifically its gradient and strength.
Two new analysis methods broaden the range of the HTV-analysis spectrum:
On the one hand the ion etching, which, as an alternative to the wet chemical etching, offers the possibility to structurally etch mechanically prebuilt polished surfaces based on a gas bombardment with targeted accelerated particles and, thus, to obtain a smooth polished surface, complying to highest demands. An example for that are interferences on surfaces of nickel-/ gold-PCBs, partly resulting in solderability failures, yet inconspicuously at visual inspection. During use of electronic components, mainly under thermal exposure, the soldered junctions show only a low reliability. Such soldering junctions possess dark staining in the area of intermetallic phases and are also called „black pad“. This effect can definitely be proven via the microstructural ion etching.
As a further innovative technology on the other hand we have to mention the Electron-Backscatter-Diffraction analysis (EBSD). This examination method for the determination of crystallographic orientation in crystals at the object surface is becoming more and more important and offers, just within the scope of a Long-Term Conservation, security to the highest degree. EBSD-analytics serves the needs for evaluation and protection of a stable component quality on long-term and for the optimization of decisive conservation parameters.
A modern, quick and high-quality examination of components requires comprehensive state-of-the art laboratory equipment. Consequently, we are forced to permanently make considerable investments in order to have the most modern and most innovative analytics equipment available. HTV-Conservation meets the high requirements of the practice standards regarding most precise and most significant results and evaluations.