Via the X-ray Inspection lead-frames, bond wires and chip positions of the component, for instance, can be analysed.
Possible applications:
- Non-destructive examination of bond areas and lead-frames
- Inspection of hidden solder joints (e.g. on BGAs)
- Formation of cracks in pins or solder joints
X-ray Inspection
The necessity of a non-destructive examination of components or assemblies oftentimes requires an inspection via X-ray technology. In the process lead-frames, bond wires and chip positions of the component, for instance, can be analysed. In the case of printed circuit boards an examination of the inner conductive path layers is possible.
Soldered BGA components can be examined regarding the correct homogeneous solder joints. In case of components whose origin is doubtful an X-ray inspection can show if a chip is generally integrated into the component, if there is no deviation in the bond sequence or bond wire junctions can be recognized.