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• About HTV
  • Contacts
  • Facts and figures
  • Quality management
  • Delivery service
  • Press releases
  • Contact us
  • Informative literature
• Programming service
  • Programming of electronic components
  • Process stability
  • Development of adapters and algorithms
  • Nand-Flashes
  • Serial numbers
  • Laser marking,
    Removal of original marking
  • Fault analysis
  • Wafer-programming
  • General brochure (PDF)
• Test service
  • Testing of electronic components
  • Component qualification and environmental simulation
  • Test of series quantities
  • Incoming inspection of goods
  • Wafer-test
  • ESD-test
  • Fault analyses
  • Test-programme development, ASIC-development and packaging
  • From the wafer to the completely housed and tested component
  • Development of test-programmes as a service
  • General brochure (PDF)
• Analytics
  • Light Microscopy
  • Microsections
  • Decapsulation
  • Scanning Electron Microscopy
  • Energy Dispersive X-ray Analysis (EDX)
  • X-ray Inspection
  • 3D X-Ray
  • Fourier Transform Infrared (FTIR) Spectroscopy
  • Solderability Test
  • Ion-Beam Etching
  • Analysis of components and circuit boards
  • Reverse chip preparation DIE-Layering^®
  • Analytics brochure
• TAB^® -
  Long-Term Conservation
  • Thermal-Absorptive Gas-Barrier TAB^®
  • Procedures in comparison
  • TAB^® Long-Term Conservation – The General Concept
  • TAB^® Long-Term Conservation of modules and devices
  • Evaluation of goods and process flow
  • Spectrum of performance
  • TAB^®-mechanisms
  • Why TAB^® ?
  • Nitrogen packing
  • Conservation brochure (PDF)
• Other Services
  • 3D-lead inspection
  • Whisker detection
  • revivec ®
  • Tape&reel service
  • Drying and Dry-Packing
  • Packaging
  • Laser marking,
    removal of original marking
  • Retinning - HTV - NovaTIN^® Method