Controversy
Electronic component and device suppliers/manufacturers are living under considerable strain. Innovation/technology-cycles of semiconductors as well as the real needed life cycle of the corresponding production machinery are moving in opposite directions.
The final call for "Last Buy" has become quite standard by today. However, the complex logistics processes are very time-consuming and generate a belated information in many cases. Consequently it happens quite often that the parts, purchased and stored in the last minute, cannot be soldered anymore after one year, since quality and functionality of these devices are taken for granted without verification. Re-Design has become a key word in many companies. Meanwhile everybody is aware of the costs associated to this process but unfortunately all endeavours related to the optimization of it remain in vain.
We face a similar problem when it comes to a stop in the series production, to reparation and spare parts supply. The automotive industry segment achieves up to 50 % turnover in the After Market resulting from their excellent supply-chain organisations for spare parts (After Sales; After Market; Dependent and Independent After Market). But how really useful are these procedures, when the storage capacity, needed for the huge variety of final products, overcomes the limits? Or is it effective when in the background the product support areas are disproportionally growing up towards new development areas? And what about the questions of cost-efficiency?
All in all a high risk, since customers are entitled to insistently expect an adequate rework and replacement. At the end, the winner will be the one who will be able to provide the right solution at the right time -> but where to start?
New ideas and processes for the long-term storage of components, semiconductors, wafers and dies, the disassembly of electronic waste and/or compatible replacements and last but not least the Re-Design of complete assemblies are facing each other.