Therefore, the customer obtains a comprehensive service with only one business partner.
At a glance:
- Wafer-test
- Wafer-sawing
- Manufacturing of samples in ceramic packages
- Premold packages
- Chips in waffle-pack
- Packaging of series quantities
- Development of specific test-software
- Fully-automated tests of series quantities
Test-programme development, ASIC-development and packaging
Customer-specific components become more and more a special subject of the European electronic industry. Thus, a specific know how, especially in the field of silicon sensor technology has to be involved. HTV cooperates closely with many European semiconductor manufacturers and ASIC-producers and provides a comprehensive special knowledge with its team of highly qualified engineers, who already extensively support the customer in the development phase of a component based on specific and specially-tailored test-software.
Thus, problems regarding initial samples are detected at the earliest possible stage and corresponding changes during the next design-step are considered. Then test and screening of complete wafers are performed on high-precision HTV capacity test-systems in series quantities.