Via the close cooperation with MAF GmbH it is possible to offer to our customers also the packaging of components already tested on waffle-level.
From the wafer to the completely housed and tested component
Via the close cooperation with MAF GmbH, who has specialized in the packaging of electronic components, it is possible for us to offer to our customers also the packaging of components already tested on waffle-level. Based on the central location in Frankfurt/Oder packaged sample components and subsequently also series parts, opposite to service providers for packaging from Far East, are deliverable immediately.
These components undergo a final test at HTV according to the specified operation temperature-ranges and requirements. In this connection, our broad, manifold and most specific test-procedures detect possible failures relentlessly and guarantee the required level of test-depth. A huge number of handling-systems is available for the adaption of components to high capacity testers enabling also tests with extended temperature-ranges at large numbers of several hundred thousand parts per day.
Therefore, the customer obtains a comprehensive service with only one business partner who provides support through all steps of his ASIC-development right up to the test of series quantities.