New method at the HTV Institute for Material Analysis: Ultrasound microscopy (SAM)

With the new, non-destructive method of scanning acoustic microscopy (SAM) using ultrasound, HTV now provides the possibility to comprehensively analyse cavities, e.g. voids in potting compounds or delaminations in the PCB base material and in component packages. Thus, e.g. a complete component qualification according to IPC/JEDEC J- STD-020 is possible at HTV. In addition, mechanical components can also be examined non-destructively on cracks and cavities using the SAM ultrasonic microscope.

Due to the extremely flexible design and extensive equipment of the HTV ultrasonic microscope, a wide variety of scans, for example in accordance with IPC/JEDEC J-STD-035, can be performed and measurements can be customised to various materials and structures.