MetaFinePrep® for a qualitative and quantitative structure analysis of metallic materials
Areas of Application:
- Evaluating the hardness, toughness, brittleness, solderability as well as the chemical composition of the microstructure
- Identifying anomalies in the area of the intermetallic phase transition (possible weakenings of the solder joint adhesion)
Metallographic Microstructure Preparation
An ever increasing number of wildly differing composite materials as well as new, i.e., enhanced materials requires ever more advanced and profound analysis methods to carry out appropriate analyses under the required quality standards.
Metallographic Laboratory
Unlike more conventional analysis methods the HTV metallographic laboratory uses a unique and in-house developed sample preparation method called MetaFinePrep® to gather additional and very detailed data regarding the inner structure of the materials in question, which is impossible for said conventional analysis methods
Conventional microsection sample preparation without HTV MetaFinePrep®
This microsection sample preparation of an SMD pin shows a seemingly inconspicous solder joint with flawless adhesion.
High-selective microsection preparation with HTV-MetaFinePrep®
SMD pin with a dendritic copper structure under the high-selective preparation with MetaFinePrep®
Samples prepared with the high-selective MetaFinePrep® method show the inner metallic microstructure (unlike conventionally prepared samples): in combination with an analysis under the scanning electron mikroscope (SEM) metallic materials may be thoroughly analysed to give a competent evaluation regarding the quality and reliability of microstructures and phase transitions.
