Fully automated 3D lead inspection to thoroughly inspect electronic components’ pins and other contacts
Areas of application:
- High-precision measuring of every mechanical component parameter in accordance with the data sheet, such as complanarity, stand-off or pitch
- Marking inspection as an automated check of the component’s labelling
- Inspecting the components’ alignment in both reel and tray using pin 1 inspection
- Inspection of every type of component housing (incl. BGA and QFN)
- Detecting whiskers, even in serial numbers (beginning at a range of 25 μm whisker length)
Given the rising demands (zero errors ppm) of reliable procedures in regards to ensuring uninterrupted further processing (such as soldering), it is vital to have components adhering to their mechanical parameters in accordance with the corresponding data sheet and that all component connections are undamaged.
Unlike most inspection systems, whose measurings are merely two-dimensional, HTV’s high-precision systems employ a fully automated three-dimensional procedure which will notice all kinds of pin deformation and can thus ensure coplanarity and an exact positioning which in turn will provide a high quality in regards to assembly and solder joint quality during further processing.
Additionally, automated optical inspection (AOI) systems check both the component’s position (pin 1) and its labelling. Any flawed component will be immediately and automatically sorted out.
Following this, the bent component pins can be, if so required, straightened or smoothed out otherweise using special methods. A subsequent additional lead inspection ensures that the processed components are no longer flawed.
Detecting whiskers, which can short-circuit component pins and thus damage the components or cause other kinds of malfunctions, is possible as well, using special optical procedures.
