Repairing and modifying electronic components
Applied standards
- IPC-7711/21
- IPC/JEDEC
- J-STD-020
Areas of application:
- De-soldering of single (possibly defective) components from an electric assembly
- Mounting components on an assembly post manufacturing
- Simulating reflow to qualify components for soldering (reflow procedure)
- De-soldering of valuable obsolete components from available assemblies (refurbishing)
Rework is an umbrella term describing the process of repairing and/or modifying electronic assemblies, during which components are removed and/or soldered on. There are many varied reasons to perform reworkings.
For example, a design flaw during the electronics development phase, an incorrect assembly or a defective component can cause the entire assembly to fail and thus necessitate replacing one or more components.
The rework process is also often employed the context of research projects as well as for the development of prototypes.
Valuable obsolete components, which have been discontinued on the manufacturer’s side and are no longer available on the open market, can be de-soldered from their residual assemblies. Having been thoroughly cleaned and inspected, such as with a 3D lead inspection, these components have become reusable and can be soldered onto any type of assembly.
HTV’s state of the art reworking systems can remove components from or solder them onto a printed circuit board fully automated and using a standardized reflow solder profile (mounting of small and middling quantities).
Every step, every setting and every temperature as well is documented for a reliable process stability and a seamless retracablility.
Repairing and/or changing assemblies can be done in the swiftest time possible following the highest achievable quality standards.
