The TAB®-Long-Term Conservation Method is of decisive importance for wafers and bare DIEs to ensure long-term processability and functionality as well. Due to the drastic reduction of aging mechanisms such as the migration of atoms at chip level (diffusion processes), which can lead to leakage currents and thus to considerable malfunctions, it is possible to store wafers and DIEs for up to 50 years without significant quality losses, depending on the initial condition.
Handling and optional further processing of the goods (e.g. wafer dicing, bonding and packaging) in a clean room to prevent contamination, if required, offers the highest quality standards throughout the entire storage process. In addition, the bonding capability of the pads can be documented by a cyclic pull and shear test of bare DIEs. An optical inspection, even of wafers if so required by the customer, enables the clear identification of contaminations, cracks or discoloration.
The benefits of long-term storage of wafers
Ensuring the quality, processability and functionality for up to 50 years
Immmense reduction of aging processes
Clean Room handling and processing
Cyclic pull and shear test to check the bondability of the pads of bare DIEs
Microscopic inspection of bare DIEs, checking for impurities, cracks or colour changes
Free presentation on long-term storage of wafers
Contents of the presentation:
- Solution strategies on how to ensure their own supply of wafers in the event of a discontinuation of the production line by the wafer manufacturer.
- How to make the wafers available for future-oriented use for a long period of time.
- Insights into which conditions are important when storing and stockpiling wafers, how ageing processes work and why a special conservation method is necessary to safeguard the future and prevent obsolescence.
